AMD X570 AORUS Motherboard with Direct 8 Phases IR Digital VRM, Advanced Thermal Design with Extended & Multi-Layered Heatsink, Dual PCIe 4.0 M.2, M.2 Thermal Guard, Intel® WiFi 6 802.11ax, Intel GbE LAN with cFosSpeed, USB 3.1 Gen2 Type-C, RGB Fusion 2.0
DOMINANT IN DARKNESS
In the dark, starless night, the falcon strikes fear into the heart of its prey. Even with minimal visibility, the falcon pinpoints its prey and patiently anticipates the perfect moment to swoop in for the kill. The falcon with its laser sharp gaze dominates the darkness of night in the same manner that AORUS Core Lighting illuminates the vast AORUS ecosystem.
GET READY FOR AMD RYZEN™ 3000-SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE's dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users' performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.
AMD StoreMI Technology
GIGABYTE X570 motherboards maximize your PC's potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.
Ultimate Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards.
Advanced Thermal Design
On a small mini-ITX board, heat is easily trapped and thermal balance is not easy to achieve. To avoid thermal throttle, an improved thermal solution consisting of a heatsink with cuts, and multi-layered heatsink has been implemented on the X570 I AORUS PRO WIFI. With a LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period.
Smart Chipset Fan Heatsink
Full PCIe 4.0 Design
X570 AORUS pushes the envelope once again by featuring Full PCIe 4.0 Design, including PCIe 4.0 slots, PCIe 4.0 M.2 connectors, and delivering highly optimized performance and flexibility demanded for power users and extreme gaming enthusiasts.
Next Generation Connectivity
A high-end product needs to be future-proof so your system stays up-to-date with the latest technology. X570 AORUS motherboards provide all next generation network, storage, and WIFI connectivity to keep you up to speed.
Multi-Zone Light Show Design
Now offering more LED customizations than ever, users can truly adapt their PC to represent their lifestyle. With full RGB support and a redesigned RGB Fusion 2.0 application, the user has complete control over the LEDs which surround the motherboard.
(Please refer "CPU Support List" for more information.)
(Please refer "Memory Support List" for more information.)
Integrated Graphics Processor:
Support for up to 3 displays at the same time
Maximum shared memory of 16 GB
* For 2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors only.
Integrated in the CPU (PCIEX16):
Integrated in the Chipset:
Integrated in the CPU (M2A_SOCKET):
Integrated in the Chipset (M2B_SOCKET):
Integrated in the CPU:
Integrated in the Chipset: