AMD X570 AORUS Motherboard with 12+2 Phase IR Digital VRM, Fins-Array Heatsink & Direct Touch Heatpipe, Triple PCIe 4.0 M.2 with Thermal Guards, Intel® WiFi 6 802.11ax, Intel® GbE LAN with cFosSpeed, USB Type-C, RGB Fusion 2.0
GET READY FOR AMD RYZEN™ 3000-SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE's dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users' performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.
Ultimate Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards.
Advanced Thermal Design
X570 AORUS ULTRA reaches a perfect balance between style and performance by combining the media acclaimed Fins-Array heatsink and Direct Touch heatpipe, to heatpipe provide 30% lower MOSFET temperatures for enthusiasts, overclockers and professional gamers.
Fins-Array Heatsink with Direct Touch Heatpipe and High Thermal Conductivity Pad
X570 AORUS ULTRA uses Fins-Array Heatsink which increases the heat dissipation area by 300% compared to traditional heatsinks of the same size. Direct Touch Heatpipe helps transfer heat from MOS fins. By using LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period.
Smart Chipset Fan Heatsink
Provides 3 different operating modes to minimize noise and extend the fan’s longevity. Silent, Balanced and Performance modes, choose the mode that suits you the best in any situation.
X570 motherboards adopt a high quality ball bearing fan which guarantees 60,000* working hours.
(Please refer "CPU Support List" for more information.)
(Please refer "Memory Support List" for more information.)
Integrated Graphics Processor:
Maximum shared memory
of 16 GB
* For 2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors only.
Integrated in the CPU (PCIEX16/PCIEX8):
Integrated in the Chipset (PCIEX4/PCIEX1):
* For 3rd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen™ processors only.
Integrated in the CPU (M2A_SOCKET):
Integrated in the Chipset (M2B_SOCKET/M2C_SOCKET):
Integrated in the CPU:
Chipset+USB 2.0 Hubs: