HYTE Solid Processor Frame - Pitch Black

Key Features:

• Intel LGA 1851 Compatibility : Core Ultra 200S
• Thermal Paste : Included, 2g HYTE Thermal Goop

Solid Processor Frame
Modern Processor Performance

Wide Compatibility

Supports the latest  Intel LGA 1851,

Lowers CPU Temps

Optimizes cooler contact and mounting pressure

Keeps Your CPU Pristine

Prevents bending and warping over time due to thermal cycling

Included L-Shaped Wrench

Enables hassle-free replacement of the stock motherboard ILM

2g of Thermal Goop

Keeps your CPU ice cold with exceptional thermal conductivity and increased resistance to pump-out

Overbuilt Aluminum Frame

Elevates aesthetics and makes thermal paste cleanup easy when it’s time to sell or upgrade

Specifications

• Intel LGA 1851 Compatibility : Core Ultra 200S

• Wrench : Included, L-Shaped

• Thermal Paste : Included, 2g HYTE Thermal Goop